Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid edge couplers with layers in multiple levels

Hybrid edge couplers with layers in multiple levels

US Patent 11531164 · Granted Dec 20, 2022

Estimated economic value: $71,399,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reference markers adjacent to a cavity in a photonics chip2025
Reference markers adjacent to a cavity in a photonics chip2025
Cladding structure in the back end of line of photonics chips2025
Cladding structure in the back end of line of photonics chips2025
Calibration markers for a photonics chip2025
Photonic integrated circuit including passive optical guard2025
Plasmonic photonic structures including a layer that exhibits an electric-field-2025
Hybrid edge couplers with voids2025
Compound-semiconductor waveguides with airgap cladding2025
Polarization rotators with overlapping waveguide cores2025
Structure including hybrid plasmonic waveguide using metal silicide layer2025
Optical power splitters incorporating one or more spiral elements2025