Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for integrating current sensors in a power semiconductor module

Method and apparatus for integrating current sensors in a power semiconductor module

US Patent 11531075 · Granted Dec 20, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Manufacturing method of packaging structure for bipolar transistor with constric2025
Semiconductor device2025
Semiconductor device having a curved part in the printed circuit board2025
Semiconductor device comprising a capacitor2024
Semiconductor device having an insulating sheet and a conductive film, and metho2024
Heat exchanger having cured edge2024
Semiconductor device comprising a capacitor2024
Packaging structure for bipolar transistor with constricted bumps2023
Packaging structure for bipolar transistor with constricted bumps2023
Semiconductor device with a laser-connected terminal2023
Semiconductor device2023
Semiconductor device and manufacturing method thereof2023