Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through-silicon via crack detecting apparatus, detecting method, and semiconductor device fabrication method having the same

Through-silicon via crack detecting apparatus, detecting method, and semiconductor device fabrication method having the same

US Patent 11531057 · Granted Dec 20, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Gate isolation structure2025
Semiconductor structure and method of forming the same2025
Semiconductor device with air gaps and method of fabrication thereof2025
Semiconductor structure with a laminated layer2025
Semiconductor devices including low-k metal gate isolation and methods of fabric2025
Low parasitic capacitance contact structure2025
Dual side contact structures for source/drain regions in semiconductor transisto2025
Organic light-emitting diode displays with planarization layers2025
Memory system, memory access interface device and operation method thereof2025
Physical layer circuit, write leveling training circuit and method for calibrati2025
Contact features of semiconductor device and method of forming same2025
Semiconductor device including III-V compound semiconductor layer and manufactur2025