Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a semiconductor device having a conductive field plate and a first well

Method of manufacturing a semiconductor device having a conductive field plate and a first well

US Patent 11527624 · Granted Dec 13, 2022

Estimated economic value: $7,553,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical lens assembly and head-mounted electronic device2025
Retaining sheet and venetian blind using the same2025
Optical lens assembly and a head-mounted electronic device2025
Venetian blind slat2025
Ladder rope retaining device for venetian blind2025
Learning method for plug-in depth2025
Antenna module2025
Systems and methods of estimating thermal properties of semiconductor devices2025
Region-adapted neural network for location determination2025
Knife rack2024
Semiconductor device having conductive field plate overlapping an edge of an act2024
Semiconductor device having conductive field plate overlapping an edge of an act2024