Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat dissipation in semiconductor packages and methods of forming same

Heat dissipation in semiconductor packages and methods of forming same

US Patent 11527518 · Granted Dec 13, 2022

Estimated economic value: $7,553,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure, semiconductor device and manufacturing method thereof2025
Package structure, semiconductor device and manufacturing method thereof2025
Package structure, semiconductor device and manufacturing method thereof2025
Package structure, semiconductor device and manufacturing method thereof2025
Method for fabricating an integrated circuit comprising devices on opposing side2025
Power rails for stacked semiconductor device2025
Semiconductor packages and methods of manufacturing thereof2025
Self-aligned scheme for semiconductor device and method of forming the same2025
Integrated circuit having hybrid sheet structure2025
Metal cut region location method2025
Devices with reduced capacitances2025
Semiconductor device including parallel configuration2025