Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for producing a 3D semiconductor device and structure including metal layers

Method for producing a 3D semiconductor device and structure including metal layers

US Patent 11527416 · Granted Dec 13, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermal management systems for electronic devices and related methods2025
3D semiconductor device and structure with logic circuits, memory cells, and pro2025
3D semiconductor device and structure with logic circuits, memory cells, and pro2025
Electromagnetic wave medical imaging system, device, and methods2025
Automation methods for 3D integrated circuits and devices2025
3D semiconductor devices and structures with slits2025
3D semiconductor device and structure with three levels and isolation layers2025
3D semiconductor device and structure with three levels and isolation layers2025
3D semiconductor device and structure with three levels and isolation layers2025
3D semiconductor memory devices and structures2025
3D semiconductor device and structure with metal layers and memory cells2025
3D semiconductor device and structure with metal layers and memory cells2025