Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure, semiconductor device, and formation method for package structure

Package structure, semiconductor device, and formation method for package structure

US Patent 11515223 · Granted Nov 29, 2022

Estimated economic value: $529,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method for manufacturing semiconductor device2025
Semiconductor device and method for manufacturing semiconductor device2025
Electronic device and method for manufacturing electronic device2025
Semiconductor device and manufacturing method for semiconductor device2025
Joint structure, semiconductor device, and joining method2024
Semiconductor device manufacturing method and wafer-attached structure2024
Semiconductor device and bonding method2024
Semiconductor device and production method for semiconductor device2024
Semiconductor device and manufacturing method for semiconductor device2023
Semiconductor device manufacturing method and wafer-attached structure2023
Semiconductor device and method for manufacturing semiconductor device2023
Semiconductor device manufacturing method and wafer-attached structure2022