Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package having thermally conductive pathways

Semiconductor device package having thermally conductive pathways

US Patent 11508644 · Granted Nov 22, 2022

Estimated economic value: $5,396,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device package having improved conductive stub coverage2025
Semiconductor device package die stacking system and method2025
Semiconductor device package die stacking system and method2025
Large-scale underground shield docking model test platform and test method using2025
Arc fault detection using machine learning2025
Semiconductor device package mold flow control system and method2024
Semiconductor device package mold flow control system and method2024
Semiconductor device with unbalanced die stackup2024
Reducing keep-out-zone area for a semiconductor device2024
Packaged memory device with flip chip and wire bond dies2024
Semiconductor device package with exposed bond wires2024
Thermoelectric semiconductor device and method of making same2024