Substrate with electronic component embedded therein

Assignee

• Samsung

Inventors

• Chang Hwa Park (20 patents)
• Chi Seong Kim (10 patents)
• Eun Heay Lee (2 patents)
• Yo Han SONG (3 patents)
• Gun Hwi Hyung (2 patents)
• Jae Heun LEE (5 patents)
• Deok-Man Kang (8 patents)
• Jin Oh Park (19 patents)

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