Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked thermal processing chamber modules for remote radiative heating in semiconductor device manufacture

Stacked thermal processing chamber modules for remote radiative heating in semiconductor device manufacture

US Patent 11482433 · Granted Oct 25, 2022

Estimated economic value: $11,792,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Non-planar semiconductor device having conforming ohmic contacts2024
Non-planar semiconductor device having omega-fin with doped sub-fin region and m2022
Non-planar semiconductor device having omega-fin with doped sub-fin region and m2019
Pulsed laser anneal process for transistor with partial melt of a raised source-2019
Pulsed laser anneal process for transistors with partial melt of a raised source2016
Method for forming superactive deactivation-resistant junction with laser anneal2016
Selective laser annealing process for buried regions in a MOS device2015
Pulsed laser anneal process for transistors with partial melt of a raised source2015
Systems and methods for multi-spectral bioluminescence tomography2014
Dispenser2001
Method of processing a substrate2000
Automated highway system for controlling the operating parameters of a vehicle1995