Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package using a coreless signal distribution structure

Semiconductor package using a coreless signal distribution structure

US Patent 11476233 · Granted Oct 18, 2022

Estimated economic value: $42,254,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid electric vehicle and driving control method for same2025
Method and device for image-based malware detection, and artificial intelligence2025
Eco-friendly vehicle and method of controlling the same2025
Lighting device for vehicle2025
Vehicle information display apparatus and control method thereof2025
Semiconductor device and manufacturing method thereof2025
Semiconductor package using a coreless signal distribution structure2025
Semiconductor package using a coreless signal distribution structure2025
Semiconductor package using a coreless signal distribution structure2025
Substrate processing apparatus and substrate processing method2025
Electronic device having a substrate-to-substrate interconnection structure and 2025
Automotive crash pad and manufacturing method thereof2025