Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Assembly of flexible and integrated module packages with leadframes

Assembly of flexible and integrated module packages with leadframes

US Patent 11476182 · Granted Oct 18, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Over-the-air hardware update2024
Coordinating power transitions between a smart interconnect and heterogeneous co2024
Current load transient mitigation in display backlight driver2023
Method and apparatus to use active semiconductor interposers for RF signal chain2023
Method and apparatus to use active semiconductor interposers for RF signal chain2023
Systems and methods for increasing a pulse width modulation frequency while pres2023
Over-the-air hardware update2022
Method and apparatus to use active semiconductor interposers for RF signal chain2022
Method and apparatus to use active semiconductor interposers for RF signal chain2022
Coordinating power transitions between a smart interconnect and heterogeneous co2021
Beam former, beam forming method and hearing aid system2021
Method and systems for energy efficiency and energy conservation including on-of2020