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Home › Method and apparatus for generating a correction line indicating relationship between deviation of an edge of a wafer pattern from an edge of a reference pattern and space width of the reference pattern, and a computer-readable recording medium

Method and apparatus for generating a correction line indicating relationship between deviation of an edge of a wafer pattern from an edge of a reference pattern and space width of the reference pattern, and a computer-readable recording medium

US Patent 11468555 · Granted Oct 11, 2022

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