Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heatsink arrangement for integrated circuit assembly and method for assembling thereof

Heatsink arrangement for integrated circuit assembly and method for assembling thereof

US Patent 11456231 · Granted Sep 27, 2022

Estimated economic value: $387,436,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polypeptide magnetic nanoparticle, preparation method therefor and use thereof2025
Underwater debris suction apparatus2025
Method and apparatus for stitching dual-camera images and electronic device2024
Pool cleaner having obstacle detecting device2024
Brake pad assembly2023
Mechanism for detecting obstacles and mechanically reversing a direction of a po2023
Thermistor sensor arrangement for measuring chipset temperature2023
Thermistor sensor arrangement for measuring chipset temperature2023
Capacitance detection circuit, touch control chip and electronic device2023
Capacitance detecting circuit, touch control chip, touch detection apparatus and2023
Gas sensitive field effect transistors2022
MBD-based three-dimensional process designing method and platform for typical au2021