Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture

Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture

US Patent 11444056 · Granted Sep 13, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for making probe devices and related devices2025
Methods for making probe devices and related devices2025
Implants using ultrasonic backscatter for sensing electrical impedance of tissue2025
Static and dynamic input multiplexing for high-density neural signal recording2025
Implants using ultrasonic backscatter for sensing physiological conditions2025
Implants using ultrasonic waves for stimulating tissue2024
Spinal cord stimulation systems, methods, and devices2024
Implantable neuromodulation system for closed-loop stimulation and recording sim2023
Implantable neuromodulation system for closed-loop stimulation and recording sim2023
Network-on-chip for neurological data2023
Implants using ultrasonic backscatter for sensing electrical impedance of tissue2023
Electronic device2023