Device and method for transferring components

Assignee

• Te Connectivity Services Gmbh
• Tyco Electronics (Shanghai) Co.

Inventors

• Jian Cao (17 patents)
• Lvhai Hu (87 patents)
• Fengchun Xie (33 patents)
• Yun Liu (48 patents)
• An (Joshua) Yang (29 patents)
• Yingcong Deng (45 patents)
• Roberto Francisco-Yi Lu (125 patents)

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