Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic module for high power applications

Electronic module for high power applications

US Patent 11410977 · Granted Aug 9, 2022

Estimated economic value: $82,495,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Regulator circuit package techniques2024
Electronic component2023
Stacked circuit package with molded base having laser drilled openings for upper2023
Stacked circuit package with molded base having laser drilled openings for upper2023
Stacked circuit package with molded base having laser drilled openings for upper2023
Three-dimensional packaging techniques for power FET density improvement2022
Three-dimensional packaging techniques for power FET density improvement2022
Package with overhang inductor2022
Package with overhang inductor2022
Mechanically-compliant and electrically and thermally conductive leadframes for 2022
Mechanically-compliant and electrically and thermally conductive leadframes for 2022
Regulator circuit package techniques2021