Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dicing die-bonding film

Dicing die-bonding film

US Patent 11404301 · Granted Aug 2, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional cell culture container2025
Semiconductor adhesive composition and semiconductor adhesive film comprising cu2025
Apparatus for separating semiconductor chip and method for separating semiconduc2025
Adhesive composition for semiconductor circuit connection, adhesive film for sem2025
Adhesive sheet for temporary attachment and method for producing semiconductor d2024
Adhesive sheet for temporary attachment and method for producing semiconductor d2024
Non-conductive film and manufacturing method of semiconductor laminate2024
Non-conductive film and manufacturing method of semiconductor laminate2024
Adhesive composition for semiconductor circuit connection and adhesive film cont2024
Adhesive composition for semiconductor circuit connection and adhesive film cont2024
Resin composition for bonding semiconductor and adhesive film for semiconductor 2024
Adhesive composition for dicing tape and dicing tape comprising the same2024