Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a wire bundle and coupling the wire bundle to a structure background

Method for forming a wire bundle and coupling the wire bundle to a structure background

US Patent 11394184 · Granted Jul 19, 2022

Estimated economic value: $59,367,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for enhancing rapid data analysis2024
Systems and methods for rapid data analysis2024
Methods for stratified sampling-based query execution2024
Crash-safe tiered memory system2024
Writing data to an LSM tree file structure using consistent cache staging2023
Read iterator for pre-fetching nodes of a B-tree into memory2022
Systems and methods for rapid data analysis2022
Methods for enhancing rapid data analysis2022
Lockless synchronization of LSM tree metadata in a distributed system2021
Systems and methods for providing electrical signals to electrical devices withi2021
Auto-tuned write-optimized key-value store2021
Large range lookups for Bϵ-tree2021