Package structure and method for forming the same

Assignee

• TSMC

Inventors

• Chin-Her Chien (24 patents)
• Po-Hsiang Huang (130 patents)
• Cheng-Hung Yeh (19 patents)
• TAI-YU WANG (1 patents)
• MING-KE TSAI (1 patents)
• Yao-Hsien Tsai (4 patents)
• Kai-Yun Lin (7 patents)
• Chin-Yuan Huang (10 patents)
• Kai-Ming Liu (25 patents)
• Fong-Yuan Chang (135 patents)
• Chin-Chou Liu (87 patents)
• Yi-Kan Cheng (120 patents)

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