Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High voltage integrated circuit device employing element separation method using high voltage junction

High voltage integrated circuit device employing element separation method using high voltage junction

US Patent 11373997 · Granted Jun 28, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2025
Semiconductor device2025
Semiconductor device and method of manufacturing the same2025
Semiconductor integrated circuit2023
Method of manufacturing semiconductor integrated circuit2022
Resistance element and manufacturing method of resistance element2021
Semiconductor integrated circuit having a first buried layer and a second buried2021
High voltage integrated circuit2021
Semiconductor integrated circuit2020
Resistive element and method of manufacturing the resistive element2020
Semiconductor integrated circuit device2020
High breakdown voltage passive element2020