Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate

Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrate

US Patent 11373906 · Granted Jun 28, 2022

Estimated economic value: $15,065,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Through electrode substrate, manufacturing method thereof and mounting substrate2025
Through electrode substrate, manufacturing method thereof and mounting substrate2025
Multi-layer line structure2025
Multi-layer line structure2025
Through electrode substrate, electronic unit, method for manufacturing through e2025
Through electrode substrate and semiconductor device2024
Through electrode substrate and mounting substrate2024
Through electrode substrate and mounting substrate2024
Through electrode substrate and mounting substrate2024
Through electrode substrate and mounting substrate2024
Through electrode substrate and mounting substrate2024
Wiring board and manufacturing method of the wiring board2024