Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat sink, heat sink arrangement and module for liquid immersion cooling

Heat sink, heat sink arrangement and module for liquid immersion cooling

US Patent 11369040 · Granted Jun 21, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cooling module2025
Nozzle arrangement and cooling module2025
Nozzle arrangement and cooling module2025
Cold plate and system for cooling electronic devices2024
Cold plate and system for cooling electronic devices2024
Cold plate2024
Heat sink, heat sink arrangement and module for liquid immersion cooling2024
Heat sink, heat sink arrangement and module for liquid immersion cooling2024
Heat sink, heat sink arrangement and module for liquid immersion cooling2024
Heat sink, heat sink arrangement and module for liquid immersion cooling2024
Heat sink, heat sink arrangement and module for liquid immersion cooling2024
Cooling system for electronic modules2024