Package lead design with grooves for improved dambar separation

Assignee

• Infineon Technologies Ag

Inventors

• Jayaganasan Narayanasamy (8 patents)
• Meng How Chong (1 patents)
• Elmer Senorin Holgado (1 patents)
• Chee Ming Lam (3 patents)
• Sanjay Kumar Murugan (11 patents)
• Arivindran Navaretnasinggam (1 patents)
• Kai Yang Tan (1 patents)
• Lee Shuang Wang (12 patents)

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