Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-step aging process for improved bond durability

Multi-step aging process for improved bond durability

US Patent 11352685 · Granted Jun 7, 2022

Estimated economic value: $16,359,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-piercing rivet die, assembly, and method of joining materials with a self-p2025
Method and apparatus for adaptive control and real-time edge tracking of adhesiv2025
Methods of forming and stamping tailor friction stir welded blanks with enhanced2024
Friction element weld element modification to increase corrosion resistance of t2024
Mechanical applicator for use in stamping die process to apply thermo-chromatic 2024
Method and system for lubricating and forming a metal component from sheet metal2024
Hydroforming of porthole extrusion with non-equiangular seams2024
Device to reduce tool marks in incremental forming2024
Method and apparatus for automated adhesive wash-off quality control and root-ca2023
Method and apparatus for adaptive control and real-time edge tracking of adhesiv2023
Forming die with reverse bead geometry2023
Surface features for locating net substrate buttons to enable self-piercing rive2023