Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies

Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies

US Patent 11336286 · Granted May 17, 2022

Estimated economic value: $14,251,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for configurable interface circuits2025
Fabric die to fabric die interconnect for modularized integrated circuit devices2025
Selective use of different advanced interface bus with electronic chips2025
Modular periphery tile for integrated circuit device2024
Techniques for clock signal transmission in integrated circuits and interposers2024
Methods and apparatus for reducing microbumps for inter-die double-data rate (DD2024
Fabric die to fabric die interconnect for modularized integrated circuit devices2024
Network-on-chip for inter-die and intra-die communication in modularized integra2023
Modular periphery tile for integrated circuit device2023
Frequency translation circuitry for an interconnection in an active interposer o2023
Fabric die to fabric die interconnect for modularized integrated circuit devices2023
High-speed core interconnect for multi-die programmable logic devices2023