Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate

Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate

US Patent 11319642 · Granted May 3, 2022

Estimated economic value: $6,057,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Anode holder, and plating apparatus2025
Radiation imaging apparatus2025
Cell culture device, method for culturing cells, and method for producing produc2025
Plating method and plating apparatus2025
Terminal device and RF power supply device2024
Plating method, insoluble anode for plating, and plating apparatus2024
Substrate processing apparatus2024
Image processing apparatus, image processing method, and storage medium2024
Manufacturing method for surface mounted inductor2024
RF generator device and substrate processing apparatus2024
Hydrogenated block copolymer2024
Plating support system, plating support device, and recording medium2023