{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Fabrication of electronic devices using sacrificial seed layers", "item": "https://www.patentleaderboard.com/patent/11302800"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025

Fabrication of electronic devices using sacrificial seed layers

US Patent 11302800 · Granted Apr 12, 2022

Estimated economic value: $499,862,000

Assignee

Inventors

View full patent text on Google Patents →