Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

US Patent 11295996 · Granted Apr 5, 2022

Estimated economic value: $38,144,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for bonding semiconductor elements2020
Systems and methods for bonding semiconductor elements2020
Multi-mode wave energy converter devices and systems2014
Autonomously operated buoys with power generation and power usage control2014
Wave energy converter and power take off system2013
Low-profile capillary for wire bonding2009
Low-profile capillary for wire bonding2008
Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers2006
Die attach process using cornercube offset tool2004
Indirect imaging method for a bonding tool2004
Die attach system and process using cornercube offset tool2004
Indirect imaging system for a bonding tool2003