Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pressure-sensitive adhesive compositions for manufacturing electronic devices

Pressure-sensitive adhesive compositions for manufacturing electronic devices

US Patent 11286407 · Granted Mar 29, 2022

Estimated economic value: $46,556,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Article with thermal insulation properties2025
Polyisobutylene adhesive comprising multifunctional component with (meth)acryl o2025
Polyisobutylene adhesive comprising multifunctional component with (meth)acryl o2025
X-ray-based test device and method for plugging removal effect of sulfur dissolv2024
Double coated tape2024
Double coated tape2024
Process of manufacturing a pressure sensitive adhesive having a low VOC characte2024
Process of manufacturing a pressure sensitive adhesive having a low VOC characte2024
Process of manufacturing a pressure sensitive adhesive having a low VOC characte2024
Parallel device and method for high-precision determination of sulfur solubility2023
High-temperature and high-pressure equipment and method for microscopic visual s2022
Adhesive articles including a cushion layer and a continuous shell layer2021