Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dissipating interconnection module for M.2 form factor expansion card

Dissipating interconnection module for M.2 form factor expansion card

US Patent 11275415 · Granted Mar 15, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interlayer heat sink for cooling system of an electronic card of a supercomputer2025
Inlet heat sink for a cooling system of a supercomputer electronic board2025
Outlet heat sink for cooling system of a supercomputer electronic board2025
System and method for connecting at least one electronic card to a printed circu2023
Heatsink for multiple memory modules2022
Floor-loading load-spreading system for computer cabinet2020
Electronic board provided with a liquid cooling system2016