Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover

Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover

US Patent 11254567 · Granted Feb 22, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated energy storage component2023
Method for manufacturing a positive electrode for a solid-state lithium microbat2021
Process for encapsulation of a microelectronic device by easily manipulated thin2020
Sealing cell and method for encapsulating a microelectronic component with such 2020
Electrochemically actuatable electronic component and process for producing the 2020
Electrochemical device, such as a microbattery, and fabrication method thereof2020
Case for microelectronic components2019
Case for microelectronic components2019
Method for manufacturing an electronic device2019
Method for reversible bonding between two elements2019
Method for assembling and encapsulating lithium microbatteries and microbatterie2019
Electrochemical device, such as a microbattery or an electrochromic system, cove2019