Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and device for reducing metal burrs when sawing semiconductor packages

Method and device for reducing metal burrs when sawing semiconductor packages

US Patent 11244908 · Granted Feb 8, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming conductive structure for EMI shieldin2025
Semiconductor device and method of forming graphene-coated core embedded within 2025
Semiconductor device and method of disposing electrical components over side sur2025
Cooling device and process for cooling double-sided SiP devices during sputterin2025
Cooling device and process for cooling double-sided SiP devices during sputterin2025
Double-sided partial molded SiP module2025
Method and apparatus for codebook design in communication system2025
Method and apparatus for converting hydrocarbon-based material into acetylene or2025
Beam search method and apparatus in smart repeater system2025
Semiconductor manufacturing device and method of enhancing mold gate injector an2025
Semiconductor device and method for advanced thermal dissipation2025
Molded laser package with electromagnetic interference shield and method of maki2025