Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device and method for alignment of vertically stacked wafers and die

Device and method for alignment of vertically stacked wafers and die

US Patent 11205621 · Granted Dec 21, 2021

Estimated economic value: $57,242,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Forming self-aligned vias and air-gaps in semiconductor fabrication2025
Semiconductor structure and fabrication method thereof2025
Stacked transistors with different channel widths2025
Integrated circuit devices and fabrication techniques2025
Threshold adjustment for quantum dot array devices with metal source and drain2024
Silicon on insulator device with partially recessed gate2024
Integrated circuit devices and fabrication techniques2023
Atomic layer deposition of selected molecular clusters2023
Method of making interconnect structure having ferroelectric capacitors exhibiti2023
Gate all around vacuum channel transistor2023
Low power biological sensing system2023
Stacked transistors with different channel widths2022