Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat dissipating structure capable of conducting heat from a detachable module to a case module, and electronic device therewith

Heat dissipating structure capable of conducting heat from a detachable module to a case module, and electronic device therewith

US Patent 11202391 · Granted Dec 14, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Light guiding column with a waterproofing function, electronic device with the l2022
Adjustable wireless accessible point2022