Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › CMOS image sensor packaging structure and fabrication method thereof, and camera device

CMOS image sensor packaging structure and fabrication method thereof, and camera device

US Patent 11201187 · Granted Dec 14, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fingerprint identification module, method for forming fingerprint identification2024
Deep trench isolation for RF devices on SOI2018
Method for forming deep trench isolation for RF devices on SOI2016
LCOS display unit and method for forming the same2013
LCOS display unit and method for forming the same2011
Method and resulting structure using silver for LCOS devices2011