{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "3D semiconductor structure and method of fabricating the same", "item": "https://www.patentleaderboard.com/patent/11195831"}]}

Home › 3D semiconductor structure and method of fabricating the same

3D semiconductor structure and method of fabricating the same

US Patent 11195831 · Granted Dec 7, 2021

Estimated economic value: $3,310,000 ⓘ

Assignee

United Microelectronics

Inventors

Yung-Chen Chiu (3 patents)
Sheng-Yuan Hsueh (57 patents)
Kuo-Hsing Lee (48 patents)
Chien-Liang Wu (25 patents)
Chih-Kai Kang (25 patents)
Guan-Kai Huang (6 patents)

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