Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Display panel and chip-on-film (COF) package bonding structure, panel bonding pins, package bonding pins, and display panel and COF package bonding method

Display panel and chip-on-film (COF) package bonding structure, panel bonding pins, package bonding pins, and display panel and COF package bonding method

US Patent 11184982 · Granted Nov 23, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wearable device based on free shape cutting technique and preparation method the2022
Testing apparatus and testing method for display panel2020
Organic light emitting diode display panels and manufacturing methods thereof, d2019