Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

US Patent 11177355 · Granted Nov 16, 2021

Estimated economic value: $14,943,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package and manufacturing method of the same2025
Multi-liner TSV structure and method forming same2025
Package structure with conductive patterns in a redistribution layer2025
Heterogeneous bonding structure and method forming same2025
Method for forming mark, packaging method of semiconductor device, and semicondu2025
Semiconductor structure and method manufacturing the same2025
MIMcap corner structures in the keep-out zones of a semiconductor die and method2025
Packages with stacked dies and methods of forming the same2025
Semiconductor device2025
Semiconductor structure and manufacturing method thereof2025
Bonding structures in semiconductor packaged device and method of forming same2025
Semiconductor package and manufacturing method thereof2025