Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor device

Method of manufacturing semiconductor devices with a paddle and electrically conductive clip connected to a leadframe and corresponding semiconductor device

US Patent 11145582 · Granted Oct 12, 2021

Estimated economic value: $25,606,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with wettable flank2025
Current transducer2025
Method of manufacturing semiconductor devices with a paddle and electrically con2024
Method of manufacturing semiconductor devices and corresponding semiconductor de2023
Pressure sensing device with cavity and related methods2023
Method of manufacturing quad flat no-lead semiconductor devices and correspondin2023
Method of manufacturing semiconductor devices and corresponding semiconductor de2022
Method of manufacturing semiconductor devices, corresponding device and circuit2021
Method of manufacturing semiconductor devices and corresponding semiconductor de2021
IC with insulating trench and related methods2021
Semiconductor package with wettable flank2021
Method of manufacturing semiconductor devices, corresponding device and circuit2020