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Home › Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assemblies

Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assemblies

US Patent 11139302 · Granted Oct 5, 2021

Estimated economic value: $16,233,000 ⓘ

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