Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnection

Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnection

US Patent 11114414 · Granted Sep 7, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Creating user interface using machine learning2025
Neural networks based multimodal transformer for multi-task user interface model2025
Online detection device and method for underwater elements based on LIBS technol2025
Rotor assembly and compressor2025
Wake-up mechanism controlling method, electronic system, non-transitory computer2025
Semiconductor device and manufacturing method therefor2025
Large die wafer, large die and method of forming the same2025
Semiconductor light-emitting device2025
Data transmission device2025
Creating user interface using machine learning2025
Charging station2025
Information playback method and device, computer readable storage medium, and el2025