Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Articles and methods of forming vias in substrates

Articles and methods of forming vias in substrates

US Patent 11114309 · Granted Sep 7, 2021

Estimated economic value: $11,685,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for making controllably bonded sheets2025
Methods for making controllably bonded sheets2025
Modeling method for a fan assembly of an aero engine2025
Siloxane plasma polymers for sheet bonding2024
Hybrid gradient-interference hardcoatings2024
Coated articles with light-altering features and methods for the production ther2024
Glass-based articles having a hard film and a crack mitigating composite structu2024
Glass electrochemical sensor with wafer level stacking and through glass via (TG2024
Methods and articles including a sheet and a carrier2024
Recycled glass and glass-ceramic carrier sustrates2023
Liquid lens design variant with temperature sensor on the outside2023
Hermetically sealed optically transparent wafer-level packages and methods for m2023