Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers

Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers

US Patent 11107732 · Granted Aug 31, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing a semiconductor device2025
Method of manufacturing a semiconductor device2025
Semiconductor device including a field stop region2025
Fastening device for releasable connection to a perforated rail of an aircraft a2025
Method of manufacturing a metal silicide layer above a silicon carbide substrate2025
Power semiconductor device and method of producing a power semiconductor device2025
Method of manufacturing a semiconductor package, die, and die package2025
Power semiconductor device having an electrode with an embedded material2025
Method of manufacturing ohmic contacts on a silicon carbide (SIC) substrate, met2025
Semiconductor device including a field stop region2025
Transistor device and method of manufacturing2025
Semiconductor device with a porous portion, wafer composite and method of manufa2025