{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Subslot bundling and acknowledgement", "item": "https://www.patentleaderboard.com/patent/11071121"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Subslot bundling and acknowledgement

Subslot bundling and acknowledgement

US Patent 11071121 · Granted Jul 20, 2021

Estimated economic value: $26,474,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solid electrolyte including polymer containing boron and fluorine structure, pre2025
Techniques for signaling a common downlink and uplink beam2025
Determining beam directions of a repeater2025
Sidelink assisted cross link interference cancellation2025
Techniques for using beams in multiple transport block scheduling2025
Parameterized codebooks for reconfigurable intelligent surface-assisted communic2025
Beam failure recovery in sidelink communications2025
BAP configuration associated with a topology identifier2025
Retransmission and selection of HARQ and MCS based on partial sensing2025
Sidelink resources based on interference cancelation capability2025
Detection or sensing-based inter-gNB CLI mitigation2025
Compensation for an intelligent reflecting surface2025