Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating semiconductor devices using a two-step gap-fill process

Method of fabricating semiconductor devices using a two-step gap-fill process

US Patent 11063218 · Granted Jul 13, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Clock integrated circuit including heterogeneous oscillators and apparatus inclu2025
Display apparatus2025
Automatic high precision battery material assessment system2025
Display panel with insulating line and connecting line extending from auxiliary 2025
Display apparatus2025
Image acquisition device and method of controlling the same2025
Image sensor with reduced crosstalk between pixels2025
Power module and method for manufacturing same2025
Display device2025
Anti-PD-L1/anti-4-1BB bispecific antibodies and uses thereof2025
Anti-PD-L1/anti-LAG3 bispecific antibodies and uses thereof2024
Semiconductor device including chalcogen compound and semiconductor apparatus in2024