Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › W-band combiner-splitter fabricated using 3-D printing

W-band combiner-splitter fabricated using 3-D printing

US Patent 11056799 · Granted Jul 6, 2021

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Near-field narrow-band microwave device for inactivation of virus2024
Electronically-controlled polarization of antenna arrays2023
Handheld and portable scanners for millimeter wave mammography and instant mammo2022
Electronically-controlled polarization of antenna arrays2021
Drone terrain surveillance with camera and radar sensor fusion for collision avo2020
Detection of drones2020
Integrated ultra wideband, wafer scale, RHCP-LHCP arrays2019
Integrated wafer scale, high data rate, wireless repeater placed on fixed or mob2017
Reconfigurable antenna with cluster of radiating pixelates2017
Monitoring of wells to detect the composition of matter in boreholes and propped2017
MEMS tunneling micro seismic sensor2017
Robotic sense-through-wall sensor with simplified control interface2017