Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip-scale package device

Chip-scale package device

US Patent 11049781 · Granted Jun 29, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal oxide semiconductor with multiple drain vias2025
Thin semiconductor packaging unit having a plurality of bridging layers2025
Packaged component with composite pin structure and manufacturing method thereof2025
Power semiconductor package unit of surface mount technology including a plastic2024
Method for manufacturing side wettable package2024
Method for manufacturing a semiconductor package having a conductive pad with an2023
Semiconductor package element2023
Semiconductor package structure and fabricating method of the same2023
Semiconductor package having a conductive pad with an anchor flange2023
Side wettable package2022
Semiconductor device with conductive film shielding2020
Solderless inter-component joints2019