Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having an inter-layer via (ILV), and method of making same

Semiconductor device having an inter-layer via (ILV), and method of making same

US Patent 11024634 · Granted Jun 1, 2021

Estimated economic value: $15,212,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2025
Semiconductor device2025
Liquid cooling radiator for liquid coolers2025
Liquid cooling device with a heat-resisting structure2025
Bit line pre-charge circuit and method2025
Semiconductor device including distributed write driving arrangement2025
Memory array circuit and method of manufacturing same2025
Memory device and method for reducing active power consumption thereof using add2025
Latch type sense amplifier for testing2025
Latch type sense amplifier for testing2025
Memory device with word line pulse recovery2025
Memory computation method2025