Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for producing a microelectromechanical component and wafer system

Method for producing a microelectromechanical component and wafer system

US Patent 10994989 · Granted May 4, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sn—Cu mixed alloy solder paste, method of making the same and soldering method2024
Pressure sensor system, measuring device and method for the manufacture thereof 2022
Pressure sensor system, measuring device and method for the manufacture thereof 2022
Pressure sensor device and pressure sensor with a pressure transmitter providing2022
Pressure sensor stacking arrangement, measuring device and method for the produc2021
Pressure sensor system having a land grid array/mold premold structure and metho2021
Microphone with encapsulated moving electrode2020
Photonic crystal sensor structure and a method for manufacturing the same2019
Sensor device, in particular for use in a motor vehicle2018
System and method for a MEMS transducer2018
Micromechanical pressure sensor2018
Method of manufacturing a lithium ion battery2018